Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah

/PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today broke ground on its new 300-mm semiconductor wafer fabrication plant (or "fab") in Lehi, Utah.

Texas Instruments breaks ground in Sherman, commits to $30 billion and four chip plants

Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah

Texas Instruments Begins Construction of Its Second Semiconductor Fabrication Plant in Utah

Texas Instruments' Newest Fab Plant in Richardson Kicks Off Wafer Production » Dallas Innovates

Lindsay Weimer on LinkedIn: Texas Instruments breaks ground on new 300-mm semiconductor wafer…

TI simplifies current sensing with the industry's most accurate Hall-effect sensors and integrated shunt solutions

Texas Instruments Breaks Ground On 2nd Utah Plant

Lindsay Weimer on LinkedIn: Texas Instruments breaks ground on new 300-mm semiconductor wafer…

Texas Instruments breaks ground on 'greatest single economic investment' in Utah history

Texas Instruments Begins Construction of Its Second Semiconductor Fabrication Plant in Utah

Lose power, not data. New ultra-low-power FRAM microcontrollers from Texas Instruments revolutionize context save and restore

TI will splash out up to $30B on wafer fabs • The Register

Lehi, Utah: 300-mm wafer fabs

Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah

Texas Instruments breaks ground on 'greatest single economic investment' in Utah history